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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
DUAL COLOR LED LAMPS
Pb
Lead-Free Parts
LSRFUG2692-AS-PF
DATA SHEET
DOC. NO : REV. DATE :
QW0905- LSRFUG2692-AS-PF-0808 A
: 14 - Jul. - 2009
DCC
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFUG2692-AS-PF Page 1/6
Package Dimensions
2.9
3.1
3.3 1.5 MAX
4.3 6.450.5 UG SRF
0.5 TYP
18.0MIN
1
2
3
1
2.0MIN
2
3
1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED
2.0MIN 2.54TYP 2.54TYP
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0 -30 30
-60
60
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFUG2692-AS-PF Page 2/6
Absolute Maximum Ratings at Ta=25
Absolute Maximum Ratings Parameter Symbol Red Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 25 75 65 10 2000 -40 ~ +85 -40 ~ +100 Green 25 75 65 10 mA mA mW UNIT
A V
Static the anti-electrosatic *glove isElectricity or power surge will damageLED.LED. Use of a conductive wrist band or must be properly recommended when handing these All devices, equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL Emitted AlGaInP Red
COLOR
Dominant wave length
Dnm
Forward Spectral voltage halfwidth @20mA(V) nm
Viewing angle @20mA(mcd) 2 1/2 (deg)
Luminous intensity
Lens 630 White Diffused 574 20 20
Min. Max. Min. Typ. 1.5 1.7 2.4 2.6 220 90 350 160 60 60
LSRFUG2692-AS-PF
AlGaInP
Green
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFUG2692-AS-PF Page 3/6
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
60
2.0
Forward Current(mA)
40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0
Relative Intensity Normalize @20mA
50
1.0
0.0 1.0 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-20 0 20 40 60 80
1.2 1.1 1.0 0.9
2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80
0.8
Ambient Temperature( )
Ambient Temperature( )
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFUG2692-AS-PF Page 4/6
Typical Electro-Optical Characteristics Curve
UG CHIP
Fig.1 Forward current vs. Forward Voltage
60
Fig.2 Relative Intensity vs. Forward Current
2.0
Forward Current(mA)
50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0
Relative Intensity Normalize @20mA
1.0
0 1.0 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80
Relative Intensity @20mA Normalize @25
Forward Voltage@20mA Normaliz @25
2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity @20mA
1.0
0.5
0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFUG2692-AS-PF Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp( C) 260C3sec Max
260
5 /sec max
120
2/sec max Preheat 60 Seconds Max
25 0 0
50
100
150 Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFUG2692-AS-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=1055 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-405 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=655 2.RH=90%~95% 3.t=240hrs2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=1055&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=2605 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=2305 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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